Because of their good ohmic and rectifying properties, silicides are routinely used in Si technology. This approach has been recently extended to the novel devices produced using Si1−xGex alloys. Here, we study the Zr and Ti germanosilicides produced in the low thermal budget contact formation during Si/Si1−xGex heterodevice processing. Phase formation was monitored by combining a range of spectrometries with electron microscopy and x-ray diffraction techniques, while sheet resistance measurements allowed correlation of phase formation with film conductance. After completion of the reaction, the final crystalline phase was either C49–Zr(Si1−yGey)2 in the entire Ge composition (x) range, or C54–Ti(Si1−yGey)2 in the Ge composition range 0–0.47. In the Zr–Si–Ge system, the C49–Zr(Si1−yGey)2 formation temperature (Tf) decreases as x increases, and films formed at this temperature are continuous. Excess heating (above Tf) produces islanded films with embedded grains. A most significant feature of the results was that no Ge segregation was detected at any annealing temperature and that the Ge content in the C49 phase (y) remained equal to x for all x. This is in contrast to results on the C54–Ti(Si1−yGey)2 films, which were discontinuous when x>0.10, and in which Ge segregation occurred in the form of Ge-rich SiGe decorations separating the germanosilicide grains. The Ge content in the final C54 phase (y) was always lower than the value of x in the initial SiGe alloy, and the measured sheet resistance of the corresponding contacts was large. Our results indicate that the alloys formed between Zr and Si1−xGex are good candidates as stable contacts on Si1−xGex, and hence that Zr should be preferred for contacting in Ge-rich SiGe-based applications. © 2002 American Institute of Physics.