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J. Appl. Phys. 111, 024315 (2012); http://dx.doi.org/10.1063/1.3677947 (6 pages)

A nano-cheese-cutter to directly measure interfacial adhesion of freestanding nano-fibers

Xin Wang1, Johnny F. Najem2, Shing-Chung Wong2, and Kai-tak Wan1

1Mechanical & Industrial Engineering, Northeastern University, Boston, Massachusetts 02115, USA
2Mechanical Engineering, University of Akron, Akron, Ohio 44325, USA

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(Received 21 October 2011; accepted 14 December 2011; published online 27 January 2012)

A nano-cheese-cutter is fabricated to directly measure the adhesion between two freestanding nano-fibers. A single electrospun fiber is attached to the free end of an atomic force microscope cantilever, while a similar fiber is similarly prepared on a mica substrate in an orthogonal direction. External load is applied to deform the two fibers into complementary V-shapes, and the force measurement allows the elastic modulus to be determined. At a critical tensile load, “pull-off” occurs when the adhering fibers spontaneously detach from each other, yielding the interfacial adhesion energy. Loading-unloading cycles are performed to investigate repeated adhesion-detachment and surface degradation.

© 2012 American Institute of Physics

Article Outline

  1. INTRODUCTION
  2. EXPERIMENT
    1. Sample preparation
    2. Fixture for nano-cheese-cutter
    3. Nano-cheese-cutter
    4. Mechanical characterization and adhesion measurement
  3. DISCUSSION
  4. CONCLUSION

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KEYWORDS, PACS, and IPC

PACS

  • 81.16.-c

    Methods of micro- and nanofabrication and processing

International Patent Classification (IPC)

ARTICLE DATA

PUBLICATION DATA

ISSN

0021-8979 (print)  
1089-7550 (online)

For access to fully linked references, you need to log in.
    C. T. Gibson, D. J. Johnson, C. Anderson, C. Abell, and T. Rayment, Rev. Sci. Instrum. 75, 565 (2004)RSINAK000075000002000565000001.

    Z. Zong, C.-L. Chen, M. R. Dokmeci, and K.-T. Wan, J. Appl. Phys. 107, 026104 (2010)JAPIAU000107000002026104000001.

    T. Tang, A. Jogota, and C.-Y. Hui, J. Appl. Phys. 97, 074304 (2005)JAPIAU000097000007074304000001.


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