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J. Appl. Phys. 111, 023507 (2012); http://dx.doi.org/10.1063/1.3677791 (6 pages)

Synchronous imaging for rapid visualization of complex vibration profiles in electromechanical microresonators

Yoav Linzon1, Daniel J. Joe2, Bojan Ilic2, Juraj Topolancik2, Jeevak M. Parpia2, Harold G. Craighead2, and Slava Krylov3

1Department of Physics and Optical Engineering, Ort Braude College, PO Box 78, Karmiel 21982, Israel
2School of Applied and Engineering Physics, Cornell University, Ithaca, New York 14853, USA
3School of Mechanical Engineering, Faculty of Engineering, Tel Aviv University, Tel Aviv 69978, Israel

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(Received 22 November 2011; accepted 30 November 2011; published online 20 January 2012)

Synchronous imaging is used for the dynamic space-domain studies of vibration profiles in capacitively driven, thin n + doped polysilicon microbridges oscillating at rf frequencies. Fast and high-resolution actuation profile measurements of micromachined resonators are useful when significant device nonlinearities are present. For example, bridges under compressive stress near the critical Euler value often reveal complex dynamics stemming from a state close to the onset of buckling. This leads to enhanced sensitivity of the vibration modes to external conditions, such as pressure, temperatures, and chemical composition, the global behavior of which can be conveniently evaluated using synchronous imaging combined with spectral measurements. We performed an experimental study of high drive amplitude and ambient pressure effect on the resonant vibration profiles in electrically driven microbridges near critical buckling. Numerical analysis of electrostatically driven post-buckled microbridges supports the richness of complex vibration dynamics that are possible in such microelectromechanical devices.

© 2012 American Institute of Physics

Article Outline

  1. INTRODUCTION
  2. EXPERIMENTAL METHOD
  3. RESULTS AND DISCUSSION
  4. NUMERICAL MODEL
  5. NUMERICAL RESULTS
  6. CONCLUSION

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KEYWORDS, PACS, and IPC

PACS

  • 07.10.Cm

    Micromechanical devices and systems

International Patent Classification (IPC)

  • B81B

    Micro-structural devices or systems, e.g. micro-mechanical devices

  • B81C1/00

    Manufacture or treatment of devices or systems in or on a substrate

ARTICLE DATA

PUBLICATION DATA

ISSN

0021-8979 (print)  
1089-7550 (online)

For access to fully linked references, you need to log in.
    D. R. Southworth, L. M. Bellan, Y. Linzon, H. G. Craighead, and J. M. Parpia, Appl. Phys. Lett. 96, 163503 (2010)APPLAB000096000016163503000001.

    G. G. Fattinger and P. T. Tikka, Appl. Phys. Lett. 79, 290 (2001)APPLAB000079000003000290000001.

    K. Kokkonen and M. Kaivola, Appl. Phys. Lett. 92, 063502 (2008)APPLAB000092000006063502000001.

    D. R. Southworth, H. G. Craighead, and J. M. Parpia, Appl. Phys. Lett. 94, 213506 (2009)APPLAB000094000021213506000001.


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