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J. Appl. Phys. 109, 121301 (2011); http://dx.doi.org/10.1063/1.3581173 (33 pages)
ZnO Schottky barriers and Ohmic contacts
(Received 30 November 2010; accepted 10 February 2011; published online 23 June 2011)
© 2011 American Institute of Physics
Article Outline
- INTRODUCTION
- TECHNICAL BACKGROUND
- Schottky barriers
- Ohmic contacts
- EMERGING ZnO ELECTRONICS NEEDS
- Schottky barrier contacts
- Ohmic contacts
- ZnO SURFACE EFFECTS
- METAL-ZNO SCHOTTKY BARRIERS
- Early contact studies
- Surface cleaning effects
- Effects in vacuum
- Effects of impurities and defects
- Effects on Schottky barriers
- Crystal quality
- Surface treatment
- Measurement technique
- Crystal quality and surface effects
- Crystal defect variations
- Electronic effects of crystal defects and impurities
- Morphology effects
- Polarity effects
- Chemical effects on ZnO Schottky barriers
- Metal dependence of interface chemistry
- Interface chemistry and defect formation
- Defect formation and Schottky barriers
- Complementary Schottky barrier mechanisms
- OHMIC CONTACTS TO ZnO
- Background of ohmic contacts to ZnO
- Nonalloyed ohmic contacts to
n
-type ZnO
- Metallization schemes for nonalloyed ohmic contacts
- In-ZnO:
- Ti-ZnO:
- Al-ZnO:
- Al-Ti-ZnO:
- Pt-Ga-ZnO:
- Nonalloyed ohmic contacts to ZnO nanostructures
- Metallization schemes for nonalloyed ohmic contacts
- Alloyed ohmic contacts to
n
-type ZnO
- Single layer metallization schemes
- Double layer metallization schemes
- Multi-layer metallization schemes
- Alloyed ohmic contacts to
p
-ZnO
- Single layer metallization schemes
- Double layer metallization schemes
- Multilayer metallization schemes
- Ohmic contacts to ZnO alloys
- CONCLUSIONS
RELATED DATABASES
KEYWORDS and PACS
Keywords
annealing, II-VI semiconductors, metallisation, ohmic contacts, Schottky barriers, semiconductor-metal boundaries, surface cleaning, surface conductivity, wide band gap semiconductors, zinc compounds
PACS
-
Metal-nonmetal contacts
-
Surface double layers, Schottky barriers, and work functions
-
Surface cleaning, etching, patterning
-
Kinetics of defect formation and annealing
-
Metallization, contacts, interconnects; device isolation
-
Surface conductivity and carrier phenomena
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