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Journal of Applied Physics / Volume 103 / Issue 7 / PROCEEDINGS OF THE 52ND ANNUAL CONFERENCE ON MAGNETISM AND MAGNETIC MATERIALS / Hard Magnetic Materials

J. Appl. Phys. 103, 07E109 (2008); doi:10.1063/1.2830532 (3 pages)

Wax-bonded NdFeB micromagnets for microelectromechanical systems applications

Naigang Wang1,2, Benjamin J. Bowers1, and David P. Arnold1

1Interdisciplinary Microsystems Group, Department of Electrical and Computer Engineering, University of Florida, Gainesville, Florida 32611, USA
2Department of Materials Science and Engineering, University of Florida, Gainesville, Florida 32611, USA

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(Received 11 September 2007; accepted 10 October 2007; published online 22 January 2008)

A microfabrication technique is reported for the fabrication of wax-bonded micromagnets in the 100 μm–1 mm range. This dimensional size is not typically achievable by thin-film deposition techniques or by conventional macroscale magnet processing, and is of interest for magnetic microelectromechanical systems applications. The magnet fabrication approach incorporates a wax powder binder to “lock” the magnetic microparticles together to improve the coercivity. In practice, a NbFeB powder and wax powder are packed into pre-etched trenches in a silicon wafer and subsequently heated, allowing the wax to melt and bond the magnetic powder. Using this method, 500×500×320 μm3 magnets have been demonstrated with a coercivity of 737 kA/m and a maximum energy product of 16.6 kJ/m3.

© 2008 American Institute of Physics

Article Outline

  1. INTRODUCTION
  2. EXPERIMENT
  3. RESULTS
  4. CONCLUSIONS

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KEYWORDS and PACS

Keywords

boron alloys, coercive force, iron alloys, magnetic particles, micromagnetics, micromechanical devices, niobium alloys, silicon, waxes

PACS

  • 75.50.Tt

    Fine-particle systems; nanocrystalline materials

  • 75.60.Ej

    Magnetization curves, hysteresis, Barkhausen and related effects

  • 85.85.+j

    Micro- and nano-electromechanical systems (MEMS/NEMS) and devices

ARTICLE DATA

Permalink
http://link.aip.org/link/doi/10.1063/1.2830532

PUBLICATION DATA

ISSN:

0021-8979 (print)  
1089-7550 (online)

Publisher:

$abstract.society.value is a Member of CrossRef American Institute of Physics

For access to fully linked references, you need to log in.
    H. Cho and C. Ahn, J. Appl. Phys. 93, 8674 (2003)JAPIAU000093000010008674000001.


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